Report Code: 12896 | Available Format: PDF | Pages: 280
The global SiC wafer polishing market size was USD 448.1 million in 2023, and this number is expected to increase to USD 4,116.7 million by 2030, advancing at a CAGR of 37.4% during 2024–2030. This can be ascribed to the burgeoning consumption of consumer electronics associated with the rising disposable income, increasing demand for advanced polishing consumables, and growing semiconductor industry.
Furthermore, the growing usage of power electronics, especially in developing nations, such as China, India, and South Korea, owing to the rising infrastructure development activities, and increasing population is the key factor driving the market growth.
Chemical–mechanical polishing accounted for the highest revenue contribution, with a share of 45%, in 2023, and it is expected to maintain its position during the forecast period.
Moreover, the electropolishing category contributes significant revenue to the market in 2023.
Several companies are strongly focused on investments in SiC wafer R&D and production. For instance, in March 2023, Resonac Corporation stated that it has developed third-generation high-grade silicon carbide (SiC) epitaxial wafers for power semiconductors and started mass production. The HGE-3G is of greater quality than the second-generation high-grade SiC epi-wafer, which had been produced in high volumes over decades.
Similarly, in September 2022, in Roznov, Czech Republic, onsemi unveiled its expanded silicon carbide (SiC) fabrication facility. By the end of 2024, this expansion will have increased the site's production capacity by 16 times, offering 200 more employments. Over USD 150 million has already been invested by onsemi in the Roznov facility, and it planned to spend an additional USD 300 million through 2023.
The diamond slurry category will register the fastest growth during the forecast period, at a CAGR of 40%.
The polishing pads category will contribute significant revenue to the market during the coming years.
The abrasive powders category generates the largest chunk of the market revenue, a trend that will likely be maintained during the forecast period.
Due to the technological development in polishing products, they are being used in several applications, such as power electronics, LEDs, and RF devices. Polishing products include abrasive powders, diamond slurries, and pads. Several electronics and semiconductor manufacturers prefer advanced products to attain higher productivity and precision during wafer fabrication.
Moreover, modern polishing consumables offer high precision, along with uniformity. The quality of the wafer can be improved with the use of advanced consumables, which enable greater control over planarization, surface roughness, and material removal rates. These properties are important for SiC wafers, which is why in order to achieve these characteristics, they need meticulous polishing.
In addition, costs can be lowered and productivity can be enhanced with the help of modern polishing consumables. Further, they aid in minimizing material wastage and polishing time, thereby improving the efficiency of the entire process.
The power electronics category held a revenue share of 60% in 2023, and it is expected to have a significant CAGR over this decade.
Moreover, the LEDs category will register substantial growth during the prediction period.
Report Attribute | Details |
Market Size in 2023 |
USD 448.1 Million |
Market Size in 2024 |
USD 611.5 Million |
Revenue Forecast in 2030 |
USD 4,116.7 Million |
Growth Rate |
37.4% CAGR |
Historical Years |
2017-2023 |
Forecast Years |
2024-2030 |
Report Scope |
Market Trends, Drivers, and Restraints; Revenue Estimation and Forecast; Segmentation Analysis; Impact of COVID-19; Companies’ Strategic Developments; Market Share Analysis of Key Players; Company Profiling |
Segments Covered |
By Process Type; By Product Type; By Application; By Region |
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Consumer electronics, such as tablets, smartphones, laptops, and EVs, are increasingly relying on SiC-based power electronics. These components offer higher efficiency and faster switching, making them ideal for portable devices. As the demand for these electronic products increases, so will the need for enhanced polishing solutions.
Additionally, consumers are preferring energy-efficient devices, for which SiC-based components are employed in the electronics. Moreover, the increasing demand for compact ICs is stimulated by the technical developments in consumer electronics, including tablets, smartphones, and televisions, as well as the emergence of wearable devices and smart homes.
Hence, the burgeoning demand for consumer electronics, coupled with the advantages of SiC wafers in enhancing device performance and efficiency, is expected to fuel the SiC wafer polishing market as the consumer electronics industry continues to grow and evolve.
APAC will hold the largest share and register the highest growth rate during the prediction period, of 55%. This can be ascribed to the increase in the pace of economic development in emerging economies, including China, India, and South Korea; burgeoning end-use industries, high number of semiconductor and consumer electronics manufacturers, and increasing consumer spending, coupled with the rise in per capita income.
Furthermore,
North America also held a significant revenue share in 2023, and it is further expected to maintain its position during the forecast period. This is due to the presence of numerous industry players, well-established manufacturing sector, growing telecommunication industry, and rising investment by several market players.
Moreover,
Additionally, the European region is expected to grow significantly during the forecast period. This can be ascribed to the huge automotive industry, which requires a massive volume of semiconductors; growing aerospace sector; and rising investment by public and private organizations.
The semiconductor industry is growing at a high pace, which directly propels the wafer polishing market. The growth in the industry can be attributed to the increasing consumption of electronics devices across the world, burgeoning usage of such semiconductors in automotive electronics for several systems, including navigation control, collision detection, and infotainment, and wireless communications, growing demand for industrial electronics, and rising data storage. Furthermore, semiconductors are widely employed in wearable, web-integrated, wireless healthcare devices and 3D printing of human organs and medical devices, which further contributes to the market growth.
This report offers deep insights into the SiC wafer polishing market, with size estimation for 2017 to 2030, the major drivers, restraints, trends and opportunities, and competitor analysis.
The SiC wafer polishing industry will attain USD 4,116.7 million by 2030?
The SiC wafer polishing market will advance at a remarkable CAGR of 37.4%.
The key drivers are the growing need for consumer electronics, the requirement for higher-grade polishing materials, and the fast growth of the semiconductor industry.
A notable trend is the adoption of SiC-based semiconductors in industrial power electronics, tablets, smartphones, laptops, and electric vehicles (EVs), driven by their enhanced performance and power efficiency.
The Asia-Pacific region leads the market.
Another significant driver is the growing preference for power-efficient devices, especially in consumer electronics, which utilize SiC components, further boosting the demand for state-of-the-art polishing solutions.
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