Report Code: 11427 | Available Format: PDF | Pages: 121
Chapter 1. Research Background
1.1 Research Objectives
1.2 Market Definition
1.3 Research Scope
1.3.1 Market Segmentation by Platform
1.3.2 Market Segmentation by Application
1.3.3 Market Segmentation by End-Use
1.3.4 Market Segmentation by Country
1.3.5 Analysis Period
1.3.6 Market Data Reporting Unit
1.3.6.1 Value
1.4 Key Stakeholders
Chapter 2. Research Methodology
2.1 Secondary Research
2.2 Primary Research
2.2.1 Breakdown of Primary Research Respondents
2.2.1.1 By industry participant
2.2.1.2 By company type
2.3 Market Size Estimation
2.4 Data Triangulation
2.5 Assumptions for the Study
Chapter 3. Executive Summary
3.1 Battle for Market Share
Chapter 4. Introduction
4.1 Definition of Market Segments
4.1.1 By Platform
4.1.1.1 Wire-bond
4.1.1.2 Lead-frame
4.1.1.3 Flip-chip
4.1.1.4 TSV
4.1.1.5 WLCSP
4.1.2 By Application
4.1.2.1 DRAM packaging
4.1.2.2 NAND flash packaging
4.1.2.3 NOR flash packaging
4.1.2.4 3D TSV packaging
4.1.3 By End-Use
4.1.3.1 Consumer electronics
4.1.3.2 IT and telecommunication
4.1.3.3 Embedded systems
4.1.3.4 Automotive
4.1.3.5 Military and aerospace
4.1.3.6 Medical devices
4.1.3.7 Others
4.2 Advancements in Memory Packaging Technology
4.3 Market Dynamics
4.3.1 Trends
4.3.1.1 Shifting demand from DRAM to 3D TSV packaging technology
4.3.2 Drivers
4.3.2.1 Surge in fab investment activities in China
4.3.2.2 Increasing demand for smartphones
4.3.2.3 Growing popularity of autonomous driving and in-car entertainment (ICE)
4.3.2.4 High-bandwidth memory (HBM) and redistribution layer (RDL) improvements
4.3.2.5 Impact analysis of drivers on market forecast
4.3.3 Restraints
4.3.3.1 Thermal issues due to miniaturization of memory
4.3.3.2 Impact analysis of restraints on market forecast
4.3.4 Opportunities
4.3.4.1 Technological developments in multi-level fan-out wafer-level packaging (FOWLP)
4.3.4.2 Increasing spending on 3D NAND
4.4 Porter’s Five Forces Analysis
Chapter 5. Global Market Size and Forecast
Chapter 6. APAC Market Size and Forecast
6.1 By Platform
6.2 By Application
6.3 By End-Use
6.4 By Country
Chapter 7. Company Profiles
7.1 Apple Inc.
7.1.1 Business Overview
7.1.2 Product and Service Offerings
7.1.3 Key Financial Summary
7.1.4 Strategic Growth Plans
7.2 Dell EMC
7.2.1 Business Overview
7.2.2 Product and Service Offerings
7.2.3 Strategic Growth Plans
7.3 Qualcomm Technologies Inc.
7.3.1 Business Overview
7.3.2 Product and Service Offerings
7.3.3 Key Financial Summary
7.3.4 Strategic Growth Plans
7.4 International Business Machines Corporation (IBM)
7.4.1 Business Overview
7.4.2 Product and Service Offerings
7.4.3 Key Financial Summary
7.4.4 Strategic Growth Plans
7.5 Intel Corporation
7.5.1 Business Overview
7.5.2 Product and Service Offerings
7.5.3 Key Financial Summary
7.5.4 Strategic Growth Plans
7.6 Cisco Systems Inc.
7.6.1 Business Overview
7.6.2 Product and Service Offerings
7.6.3 Key Financial Summary
7.6.4 Strategic Growth Plans
7.7 Samsung Electronics Co. Ltd.
7.7.1 Business Overview
7.7.2 Product and Service Offerings
7.7.3 Key Financial Summary
7.7.4 Strategic Growth Plans
7.8 Winbond Electronics Corp.
7.8.1 Business Overview
7.8.2 Product and Service Offerings
7.8.3 Key Financial Summary
7.8.4 Strategic Growth Plans
7.9 Fujitsu Limited
7.9.1 Business Overview
7.9.2 Product and Service Offerings
7.9.3 Key Financial Summary
7.9.4 Strategic Growth Plans
7.1 LG Electronics Inc.
7.10.1 Business Overview
7.10.2 Product and Service Offerings
7.10.3 Key Financial Summary
7.10.4 Strategic Growth Plans
7.11 Toshiba Corporation
7.11.1 Business Overview
7.11.2 Product and Service Offerings
7.11.3 Key Financial Summary
7.11.4 Strategic Growth Plans
7.12 SK hynix Inc.
7.12.1 Business Overview
7.12.2 Product and Service Offerings
7.12.3 Key Financial Summary
7.12.4 Strategic Growth Plans
7.13 Nanya Technology Corporation
7.13.1 Business Overview
7.13.2 Product and Service Offerings
7.13.3 Key Financial Summary
7.13.4 Strategic Growth Plans
7.14 ASE Group
7.14.1 Business Overview
7.14.2 Product and Service Offerings
7.14.3 Key Financial Summary
7.14.4 Strategic Growth Plans
7.15 NEC Corporation
7.15.1 Business Overview
7.15.2 Product and Service Offerings
7.15.3 Key Financial Summary
7.15.4 Strategic Growth Plans
7.16 STMicroelectronics N.V.
7.16.1 Business Overview
7.16.2 Product and Service Offerings
7.16.3 Key Financial Summary
7.16.4 Strategic Growth Plans
7.17 Micron Technology Inc.
7.17.1 Business Overview
7.17.2 Product and Service Offerings
7.17.3 Key Financial Summary
7.17.4 Strategic Growth Plans
7.18 Western Digital Corporation
7.18.1 Business Overview
7.18.2 Product and Service Offerings
7.18.3 Key Financial Summary
7.18.4 Strategic Growth Plans
Chapter 8. Appendix
8.1 Abbreviations
8.2 Sources and References
8.3 Related Reports
LIST OF TABLES
TABLE 1 ANALYSIS PERIOD OF THE STUDY
TABLE 2 GLOBAL MEMORY PACKAGING MARKET, BY REGION, $M (2017E–2023)
TABLE 3 TECHNICAL IMPROVEMENTS IN WIRE BONDING
TABLE 4 APAC MEMORY PACKAGING MARKET, BY PLATFORM, $M (2017E–2023)
TABLE 5 APAC MEMORY PACKAGING MARKET, BY APPLICATION, $M (2017E–2023)
TABLE 6 APAC MEMORY PACKAGING MARKET, BY END-USE, $M (2017E–2023)
TABLE 7 APAC MEMORY PACKAGING MARKET, BY COUNTRY, $M (2017E–2023)
TABLE 8 APPLE INC. – AT A GLANCE
TABLE 9 APPLE INC. – KEY FINANCIAL SUMMARY
TABLE 10 DELL EMC – AT A GLANCE
TABLE 11 QUALCOMM TECHNOLOGIES INC. – AT A GLANCE
TABLE 12 QUALCOMM TECHNOLOGIES INC. – KEY FINANCIAL SUMMARY
TABLE 13 IBM CORPORATION– AT A GLANCE
TABLE 14 IBM CORPORATION– KEY FINANCIAL SUMMARY
TABLE 15 INTEL CORPORATION – AT A GLANCE
TABLE 16 INTEL CORPORATION – KEY FINANCIAL SUMMARY
TABLE 17 CISCO SYSTEMS – AT A GLANCE
TABLE 18 CISCO SYSTEMS – KEY FINANCIAL SUMMARY
TABLE 19 SAMSUNG ELECTRONICS - AT A GLANCE
TABLE 20 SAMSUNG ELECTRONICS – KEY FINANCIAL SUMMARY
TABLE 21 WINBOND ELECTRONICS – AT A GLANCE
TABLE 22 WINBOND ELECTRONICS – KEY FINANCIAL SUMMARY
TABLE 23 FUJITSU LIMITED – AT A GLANCE
TABLE 24 FUJITSU LIMITED - KEY FINANCIAL SUMMARY
TABLE 25 LG ELECTRONICS – AT A GLANCE
TABLE 26 LG ELECTRONICS – KEY FINANCIAL SUMMARY
TABLE 27 TOSHIBA CORPORATION – AT A GLANCE
TABLE 28 TOSHIBA CORPORATION – KEY FINANCIAL SUMMARY
TABLE 29 SK HYNIX – AT A GLANCE
TABLE 30 SK HYNIX – KEY FINANCIAL SUMMARY
TABLE 31 NANYA TECHNOLOGY CORPORATION – AT A GLANCE
TABLE 32 NANYA TECHNOLOGY CORPORATION – KEY FINANCIAL SUMMARY
TABLE 33 ASE GROUP – AT A GLANCE
TABLE 34 ASE GROUP – KEY FINANCIAL SUMMARY
TABLE 35 NEC CORPORATION – AT A GLANCE
TABLE 36 NEC CORPORATION – KEY FINANCIAL SUMMARY
TABLE 37 STMICROELECTRONICS – AT A GLANCE
TABLE 38 STMICROELECTRONICS – KEY FINANCIAL SUMMARY
TABLE 39 MICRON TECHNOLOGY – AT A GLANCE
TABLE 40 MICRON TECHNOLOGY– KEY FINANCIAL SUMMARY
TABLE 41 WESTERN DIGITAL CORPORATION – AT A GLANCE
TABLE 42 WESTERN DIGITAL CORPORATION – KEY FINANCIAL SUMMARY
LIST OF FIGURES
FIG 1 RESEARCH METHODOLOGY
FIG 2 BREAKDOWN OF PRIMARY RESEARCH BY INDUSTRY PARTICIPANT
FIG 3 BREAKDOWN OF PRIMARY RESEARCH BY COMPANY TYPE
FIG 4 DATA TRIANGULATION APPROACH
FIG 5 APAC MEMORY PACKAGING MARKET SUMMARY
FIG 6 ADVANCEMENTS IN MEMORY PACKAGING TECHNOLOGY
FIG 7 DRIVERS FOR THE MARKET: IMPACT ANALYSIS
FIG 8 RESTRAINTS FOR THE MARKET: IMPACT ANALYSIS
FIG 9 PORTER’S FIVE FORCES ANALYSIS
FIG 10 APAC MEMORY PACKAGING MARKET, BY PLATFORM, $M (2017E–2023)
FIG 11 APAC MEMORY PACKAGING MARKET, BY APPLICATION, $M (2017E–2023)
FIG 12 APAC MEMORY PACKAGING MARKET, BY END-USE, $M (2017E–2023)
FIG 13 APAC MEMORY PACKAGING MARKET, BY COUNTRY, $M (2017E–2023)
FIG 14 APPLE INC. – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 15 QUALCOMM TECHNOLOGIES INC. – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 16 IBM CORPORATION – REVENUE SPLIT BY REPORTABLE SEGMENT AND BY GEOGRAPHY (2023)
FIG 17 INTEL CORPORATION REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2016)
FIG 18 CISCO SYSTEMS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 19 SAMSUNG ELECTRONICS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 20 FUJITSU LIMITED – REVENUE SPLIT BY REPORTABLE SEGMENT AND BY GEOGRAPHY (2023)
FIG 21 LG ELECTRONICS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2016)
FIG 22 TOSHIBA CORPORATION – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 23 SK HYNIX – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 24 ASE GROUP – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 25 NEC CORPORATION – REVENUE SPLIT BY OPERATING SEGMENT (2023)
FIG 26 STMICROELECTRONICS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
FIG 27 MICRON TECHNOLOGY – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2016)
FIG 28 WESTERN DIGITAL CORPORATION – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2023)
Want a report tailored exactly to your business strategy?
Request CustomizationWant an insight-rich discussion with the report author?
Speak to AnalystOur dedication to providing the most-accurate market information has earned us verification by Dun & Bradstreet (D&B). We strive for quality checking of the highest level to enable data-driven decision making for you
Our insights into the minutest levels of the markets, including the latest trends and competitive landscape, give you all the answers you need to take your business to new heights
With 24/7 research support, we ensure that the wheels of your business never stop turning. Don’t let time stand in your way. Get all your queries answered with a simple phone call or email, as and when required
We take a cautious approach to protecting your personal and confidential information. Trust is the strongest bond that connects us and our clients, and trust we build by complying with all international and domestic data protection and privacy laws