The increasing deployment of EVs and the rising demand for power electronic modules across various industries, such as aerospace, medical, and defense, are propelling the Indian discrete power semiconductor devices market. Due to the aforementioned factors, the industry is projected to generate $2,834.2 million revenue in 2030, advancing at a CAGR of 12.2% during 2021–2030.
During the COVID-19 pandemic, most automotive plants and manufacturing companies, including discrete power semiconductor devices producers, were not operating and thus they were severely affected. Moreover, governmental measures, including lockdowns and social distancing, had hampered the production of semiconductor components, which further led to disruption in the supply chain. Moreover, due to the work from home culture and shift in purchasing behavior, the demand for new vehicles reduced significantly, which resulted in the weak requirements for semiconductor components in the industrial, automotive, and consumer electronics sectors. Due to the abovementioned factors, there was a decline in the sales of discrete power semiconductor devices in the pandemic time.
The industry is categorized into EV, solar power generation, domestic power inverter, power sector, and others, based on application. Among these, the EV category is estimated to have held the largest market share in 2021, and it is expected to hold the same position during the forecast period as well. This can be majorly attributed to the adoption of several policies by the Indian government to encourage the deployment of EVs. For instance, in August 2021, the Ministry of Road Transport and Highways issued a notification exempting EVs from charges for the issue or renewal of registration certificates.
Moreover, the market is categorized into TO-220, TO-247, TO-262, TO-263, TO-273, and others, based on package type. Among these, the TO-247 category is expected to record the fastest growth during the forecast period. This can be mainly because this package type provides space advantage over conventional power packages, with a thinner and smaller molded body package outline, dissipates heat directly to an external heat sink through an exposed die attach pad on the backside of the package, and minimizes the mechanical stress on the die during mounting of the molded package by screws rather than through soldering of the pad.
Players in the industry have been extensively involved in product launches. For instance, in February 2022, Littelfuse Inc. announced SP33R6, a series of four-channel, low capacitance (0.2 pF) TVS diode arrays. These robust diodes offer extremely low breakdown/turn-on voltages, making them ideal protectors of high-speed data lines with low voltage (from –0.3 V to +0.3 V). Without performance degradation, they can safely absorb repetitive electrostatic discharge (ESD) strikes above the maximum level specified in the International Electrotechnical Commission (IEC) 61000-4-2 international standard (level 4, ±8 kV contact discharge).
Similarly, in January 2022, Vishay Intertechnology Inc. introduced two new n-channel TrenchFET MOSFETs that enhance power density, efficiency, and board-level reliability in telecom and industrial applications. The 60 V SiJH600E and 80 V SiJH800E combine ultra-low on-resistance with a high-temperature operation to +175 °C and high continuous drain current handling. Their space-saving PowerPAK 8x8L package promotes board-level reliability with its bond wireless construction and gullwing leads for mechanical stress relief.
Key enterprises in the Indian discrete power semiconductor devices market include Infineon Technologies AG, NXP Semiconductors N.V., STMicroelectronics N.V., ABB Ltd., Renesas Electronics Corporation, Fuji Electric Co. Ltd., Microchip Technology Incorporated, ON Semiconductor Corporation, Taiwan Semiconductor Manufacturing Company Limited (TSMC), and Wolfspeed Inc.