Report Code: SE10035 | Available Format: PDF
Failure analysis is the technique of analyzing the cause of component failure in equipments. It is used by original equipment manufacturers (OEM) during the manufacturing process and also used during the service and maintenance of devices. The failure analysis can be performed by both, physical as well as chemical methodology. It is an engineering technique for “why and how” analysis of the equipment failure.
Failure analysis techniques are important tools for various industries, particularly in manufacturing, for new product development and efficiency enhancement of existing machineries and equipment. Failure analysis equipment measures the main origin for failure of devices and minimizes the chances of reoccurrence of similar faults in future. Some of the most regular reasons for failure include manufacturing defects, misuse, assembly errors, inappropriate materials, design errors, improper maintenance, inadequate quality assurance, insufficient environmental protection, casting discontinuities and unanticipated operating situations.
Based on product type, the global failure analysis market is divided into transmission electron microscope, scanning electron microscope, dual beam system and focused ion beam system. Based on end users of failure analysis equipment, the market is divided as semiconductors manufacturing, bio medical and life sciences, fiber optics, nanotechnology and nanomaterials, metallurgy and polymers. And on the basis of technology, the failure analysis market is segmented as focused ion beam, secondary ion mass spectroscopy, broad ion milling, reactive ion etching, chemical mechanical planarization and energy dispersive x-ray spectroscopy.
The failure analysis market is driven by various factors including, increasing demand for failure analysis equipment from wireless communication and electronics manufacturing industries as the predominant driver. The ever decreasing size and complicated circuit design requirement of semiconductor and embedded system has led to wide acceptance of failure analysis equipment during the development process of integrated circuits (ICs). Moreover, the demand from other manufacturing industries such as oil and gases and mining is boosting the market of failure analysis equipment.
The development of new and advanced technology such as correlative light and electron microscopy (CLEM) and super-resolution microscopy is offering new growth opportunities and it is expected to drive the growth of failure analysis equipment market during the forecasted period.
The speculation regarding the efficiency of the failure analysis equipment is acting as one of the major challenge for the industry. Moreover, the high price of failure analysis equipment is restricting the wide adoption of these, especially by the cost sensitive small and medium scale industries in Asia-Pacific region.
Asia-Pacific is the largest market for failure analysis attributed to the high concentration of semiconductor industries in countries such as Taiwan, China, Japan, South Korea and India. It is then followed by North America and Europe. The growth is still highest in Asia-Pacific and it is expected that market will experience a double digit growth in this region during the forecasted period.
Some of the major competitors in the global failure analysis market are A&D Co. Ltd, Carl Zeiss, FEI Company, Hitachi High-Technologies, JEOL Ltd. and Axcelis Technologies Inc.
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