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Chemical Mechanical Planarization (CMP) Market

Global Chemical Mechanical Planarization (CMP) Market Size, Share, Development, Growth and Demand Forecast to 2023

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Report Code: SE10458
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Chapter 1. Research Background

1.1. Research Objectives

1.2. Market Definition

1.3. Research Scope

1.3.1. Market Segmentation by Type

1.3.2. Market Segmentation by Technology

1.3.3. Market Segmentation by Application

1.3.4. Market Segmentation by Geography

1.3.5. Analysis Period

1.3.6. Market Data Reporting Unit

1.3.6.1. Value

1.4. Key Stakeholders

Chapter 2. Research Methodology

2.1. Secondary Research

2.2. Primary Research

2.2.1. Breakdown of Primary Research Respondents

2.2.1.1. By region

2.2.1.2. By industry participant

2.2.1.3. By company type

2.3. Market Size Estimation

2.4. Data Triangulation

2.5. Assumptions for the Study

Chapter 3. Executive Summary

Chapter 4. Introduction

4.1. Definition of Market Segments

4.1.1. By Type

4.1.1.1. Slurry

4.1.1.1.1. Oxide

4.1.1.1.2. Cu barrier

4.1.1.1.3. Cu step 1

4.1.1.1.4. Tungsten

4.1.1.1.5.  Shallow trench isolation (STI)

4.1.1.2. Pads

4.1.1.2.1. Planarizing

4.1.1.2.2. Buff 200

4.1.1.2.3. Planarizing 200

4.1.1.2.4. Buff 300

4.1.1.3. Cleaning solutions

4.1.1.4. Pad conditioner

4.1.1.5. Polyvinyl Acetal (PVA) brushes

4.1.2. By Technology

4.1.2.1. Leading edge

4.1.2.2. Mainstream

4.1.2.3. Emerging

4.1.3. By Application

4.1.3.1. Micro electro mechanical systems (MEMS) & Nano electro mechanical systems (NEMS)

4.1.3.2. Semiconductor fabrication

4.1.3.3. Optics

4.2. Value Chain Analysis

4.3. Market Dynamics

4.3.1. Trends

4.3.2. Drivers

4.3.2.1. Impact analysis of drivers on market forecast

4.3.3. Restraints

4.3.3.1. Impact analysis of restraints on market forecast

4.3.4. Opportunities

4.4. Porter’s Five Forces Analysis

Chapter 5. Global Market Size and Forecast

5.1. By Type

5.1.1. Slurry

5.1.1.1. Oxide

5.1.1.2. Cu barrier

5.1.1.3. Cu step 1

5.1.1.4. Tungsten

5.1.1.5. STI

5.1.2. Pads

5.1.2.1. Planarizing

5.1.2.2. Buff 200

5.1.2.3. Planarizing 200

5.1.2.4. Buff 300

5.1.3. Cleaning Solutions

5.1.4. Pad Conditioner

5.1.5. PVA Brushes

5.2. By Technology

5.2.1. Leading Edge

5.2.2. Mainstream

5.2.3. Emerging

5.3. By Application

5.3.1. MEMS & NEMS

5.3.2. Semiconductor Fabrication

5.3.3. Optics

5.4. By Region

5.4.1. North America

5.4.2. Europe

5.4.3. Asia-Pacific

5.4.4. Rest of the World (RoW)

Chapter 6. North America Market Size and Forecast

6.1. By Type

6.2. By Technology

6.3. By Application

6.4. By Country – The U.S. and Canada

Chapter 7. Europe Market Size and Forecast

7.1. By Type

7.2. By Technology

7.3. By Application

7.4. By Country – The U.K., Germany, France, Rest of Europe

Chapter 8. Asia-Pacific Market Size and Forecast

8.1. By Type

8.2. By Technology

8.3. By Application

8.4. By Country – China, Japan, India, Rest of Asia-Pacific

Chapter 9. RoW Market Size and Forecast

9.1. By Type

9.2. By Technology

9.3. By Application

9.4. By Country – UAE, South Africa, Mexico, Others

Chapter 10. Competitive Landscape

10.1. Market Share Analysis of Key Players

10.2. Competitive Analysis of Key Players

10.3. Product Benchmarking of Key Players

10.4. Global Strategic Developments of Key Players

Chapter 11. Company Profiles

11.1. Applied Materials, Inc

11.1.1. Business Overview

11.1.2. Product and Service Offerings

11.1.3. Key Financial Summary

11.1.4. Strategic Growth Plans

11.2. Ebara Corporation

11.2.1. Business Overview

11.2.2. Product and Service Offerings

11.2.3. Key Financial Summary

11.2.4. Strategic Growth Plans

11.3. Lapmaster International

11.3.1. Business Overview

11.3.2. Product and Service Offerings

11.3.3. Key Financial Summary

11.3.4. Strategic Growth Plans

11.4. LAM Research Corporation

11.4.1. Business Overview

11.4.2. Product and Service Offerings

11.4.3. Key Financial Summary

11.4.4. Strategic Growth Plans

11.5. Revasum

11.5.1. Business Overview

11.5.2. Product and Service Offerings

11.5.3. Key Financial Summary

11.5.4. Strategic Growth Plans

11.6. Okamoto Machine Tool Works, Ltd

11.6.1. Business Overview

11.6.2. Product and Service Offerings

11.6.3. Key Financial Summary

11.6.4. Strategic Growth Plans

11.7. Cabot Microelectronics Corporation

11.7.1. Business Overview

11.7.2. Product and Service Offerings

11.7.3. Key Financial Summary

11.7.4. Strategic Growth Plans

11.8. Rohm and Haas

11.8.1. Business Overview

11.8.2. Product and Service Offerings

11.8.3. Key Financial Summary

11.8.4. Strategic Growth Plans

11.9. Fujimi Incorporated

11.9.1. Business Overview

11.9.2. Product and Service Offerings

11.9.3. Key Financial Summary

11.9.4. Strategic Growth Plans

11.10. Hitachi Chemical Company, Ltd.

11.10.1. Business Overview

11.10.2. Product and Service Offerings

11.10.3. Key Financial Summary

11.10.4. Strategic Growth Plans

*Note: Key financial summary and strategic growth plans will be provided on best effort basis and is subject to availability of information during primary and secondary research.

Chapter 12. Appendix

12.1. Abbreviations

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